The development of SynTECH-LF™ a lead-free synthetic, no-clean solder paste, is another excellent example of AMTECH designing a product to “fill a void.” Made by substituting 100% synthetic poly adduct components for organic compounds, SynTECH-LF solder paste is capable of increasing hourly throughput up to 30% with less scrap and rework. Benefits of SynTECH-LF include:

• Lead content guaranteed to be <200 ppm
• Higher production yields
• Synthetic, not organic, for unparalleled lot-to-lot and stencil printing consistency
• Wider process windows (12 hour stencil life, 12-16 hour tack time)
• RELO flux designation
• 1.56% BONO copper mirror test
• ICT friendly, and compatible with organic solderability preservatives (OSPs)
• 88.5% metal loading

SynTECH-LF offers superior wetting, strong activity and shelf life. Other product benefits include superior stencil printing characteristics as well as ideal viscosity, grain size and particle sphericity (even at higher melting temperatures), resulting in higher quality solder joints at higher processing speeds with fewer solder balls or voids. SynTECH-LF also leaves a non-conductive, non-corrosive, post reflow residue that acts as a protective coating, and can easily be removed using Kyzen® or Petroform® solvent cleaners.

SynTECH-LF™ Data Sheet
SynTECH-LF™ MSDS
Third Party Test Data for SynTECH-LF
SGS report for SynTECH-LF solder paste
BONO Test report for SynTECH-LF