SynTECH

Data Sheet (PDF)

MSDS (PDF)

The SynTECH series solder paste is a synthetic poly-adduct designed to exceed requirements for reliable solder joints in SMT PC board assemblies. This paste was formulated to replace traditional rosin/resin based no-clean formulations with more reliable synthetic materials. The residue is pin probable for ICT inspection. The SynTECH series does not require refrigeration if left at room temperature for 6 months and has a 12-month refrigerated shelf life.

REL0

NC-559

Data Sheet (PDF)

MSDS (PDF)

The NC-559 series is designed to meet requirements for reliable solder joints in SMT PC board assemblies. This formula was designed to have a wider process window and better compatibility with OSP surfaces. This formulation exhibits long print life in continuous printing operations. Residue can be removed using traditional solvents or Kyzen's Aquanox® with semi-aqueous systems.

NC-559-AS

Data Sheet (PDF)

MSDS (PDF)

The 559-AS solder paste was formulated with an extended tack and stencil life. The residue of 559-AS is pin probable for ICT inspection. This formula is designed to be very robust with a wider profiling window.

NC-559-ASM

Data Sheet (PDF)

MSDS (PDF)

The NC-559-ASM is a modified version of the NC-559-AS that contains a U.V. tracer for easier flux splatter inspection. This modified version is completely odorless. This product is designed for manual or semi-automatic stencil printing, where the operator is exposed to the smell of the product.

WS-486

Data Sheet (PDF)

MSDS (PDF)

The WS-486 is a non-resin formula that was developed to replace earlier water-soluble creams, containing no insoluble components. Excellent printability and stencil life is obtained for the most demanding applications, including hard to solder metallization, and harsh operating environments.

NWS-4100

Data Sheet (PDF)

MSDS (PDF)

The AMTECH NWS-4100 series is a new class of water washable formulations. Scientists at AMTECH have developed a water-soluble version of the innovative polymer-dendrimer activator system. This activator system, coupled with a highly stable, clean rinsing binder, provides the excellent activity, working life, and cleaning needed for today's demanding applications. Excellent in reducing voiding with BGA packages. Residues can be removed with de-ionized or soft tap water at 130-150°F.

NWS-4200

Data Sheet (PDF)

MSDS (PDF)

The AMTECH NWS-4200 series is a water washable formulation. This formulation uses the innovative polymer-dendrimer activator system. This activator system, coupled with a highly stable, clean rinsing binder, provides an increased activity. Excellent in reducing voiding with BGA packages. Residues can be removed with de-ionized or soft tap water at 130-150° F.

NWS-4200-4

Data Sheet (PDF)

MSDS (PDF)

The AMTECH NWS-4200-4 series is a new class of water washable formulations designed for difficult/oxidized pads and parts as well as OSP surfaces. This activator system, coupled with a highly stable, clean rinsing binder, provides excellent activity and working life. This formulation is not designed for BGA packages.

NWS-4200-6

Data Sheet (PDF)

MSDS (PDF)

The AMTECH NWS-4200-6 series is a new class of water washable formulations designed for difficult/oxidized pads and parts as well as OSP surfaces. This activator system, coupled with a highly stable, clean rinsing binder, provides excellent activity and working life. This formulation is not designed for BGA packages. Also designed for the use of lead-free parts on a tin-lead process.

NWS-4200-4P3

Data Sheet (PDF)

MSDS (PDF)

NWS-4200-LF

Data Sheet (PDF)

MSDS (PDF)

The AMTECH NWS-4200-LF is a water washable formulation that is formulated and designed to meet the reflow temperatures for lead-free alloys. The NWS-4200-LF exhibits exceptional print, long stencil life, and a wide reflow window. This Pb-free solder paste can maintain excellent cleanability even at elevated reflow temperatures.

NWS-4400-HA

Data Sheet (PDF)

MSDS (PDF)

AMTECH NWS-4400-HA solder paste was designed for hard-to-solder surfaces with a higher activity. The NWS-4400-HA is classified as REL0 and is available in both leaded and non-leaded alloys. Residues can be removed with de-ionized or soft tap water at 130-150° F.

LF-4300

Data Sheet (PDF)

MSDS (PDF)

A revolutionary new lead-free solder paste, LF-4300 offers true multi-process capabilities, a no-clean formula that is also water washable without saponification. Highly versatile and forgiving, LF-4300 uses synthetic materials for unparalleled lot-to-lot consistency and ideal printing characteristics (no mid-chip beading, low voiding and anti-tombstoning). LF-4300 is compatible with high temperature alloys. It’s also VOC and halide-free, and features 12-hour stencil life and 24-hour abandonment time.

4300

Data Sheet (PDF)

MSDS (PDF)

A revolutionary new solder paste designed for tin-lead alloys. 4300 offers true multi-process capabilities, a no-clean formula that is also water washable without saponification. Highly versatile and forgiving, 4300 uses synthetic materials for unparalleled lot-to-lot consistency and ideal printing characteristics (no mid-chip beading, low voiding and anti-tombstoning). This solder paste is VOC and halide-free, and features 12-hour stencil life and 24-hour abandonment time.

RMA-223

Data Sheet (PDF)

MSDS (PDF)

The RMA-223 solder paste is a homogeneous mixture of the highest quality pre-alloyed solder powders and mildly activated resin paste flux. With a special blend of gelling additives in this formulation, it prevents segregation of solder cream and provides a creamy mixture ready for application. The residue from RMA-223 is light amber and clear of solder balls. RMA-223 is a cream conforming to ANSI/J-STD-004-006.

RMA-223-AS

Data Sheet (PDF)

MSDS (PDF)

RMA-223-AS is specially designed for today's SMT applications. It is a homogeneous mixture of the highest quality pre-alloyed solder powders and mildly activated resin paste flux. The RMA-223-AS has an increased activity over the RMA-223. The residue from RMA-223-AS can be removed using traditional solvents or Kyzen's Aquanox® with semi-aqueous systems. The residue from the RMA-223-AS is light amber in color.

Data Sheet (PDF)

MSDS (PDF)

RMA-223-LF is a solder paste designed to meet the requirements of lead-free. It delivers excellent wetting and spread with Sn96.5/Ag3.5 alloy. It was designed for this alloy only. The 223-LF residue is light amber in color and is non-corrosive. The residue can be removed with solvent or Kyzen’s Aquanox with semi-aqueous systems.

Data Sheet (PDF)

MSDS (PDF)

The RMA-259-HT is designed with a higher activity than the RMA-223-AS. This product is designed for high temperature alloys, such as Sn10/Pb88/Ag2. This formula is classified as an RMA and the residues can be left on the board or removed using traditional solvents or Kyzen's Aquanox® with semi-aqueous systems.