Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it.

Both the LF-4300 and the 4300 offer true multi-process capabilities, ideal for no-clean applications and also water washable, able to be cleaned using standard aqueous cleaning systems without saponification. Both formulas also utilize synthetic materials that deliver ideal printing characteristics, unparalleled lot-to-lot consistency and extremely long stencil life. LF-4300 and 4300 are also VOC and halide-free, and classified as RELO. When used as a no-clean, their flux residue remains clear and meets S.I.R. requirements as per IPC-TM-650.2.6.33. Unique features of LF-4300 and 4300 solder paste include:

• No-Clean and Water Washable (one product for both processes)
• LF-4300 complies with RoHS directive 2002/95/EC and is suitable for high temp. alloys up to 300ºC
• RELO flux classification
• No mid-chip beading
• Low voiding
• 12-hour stencil life
• 24-hour abandonment time
• Pin Probable for ICT inspection
• Compatible with AOI inspection
• Works well in convection and vapor phase processes

Both the LF-4300 and the 4300 feature 12-hour stencil life and 24-hour abandonment time so PC assemblers can change shifts or experience prolonged downtime without jeopardizing production yields. The LF-4300 also meets RoHS directive 2002/95/EC with lead content guaranteed at <200ppm.

LF-4300 solder paste (PDF)
4300 solder paste (PDF)
LF-4300-TF tacky flux (PDF)
LF-4300 core wire (PDF)
4300 core wire (PDF)
Superior #4300-2% liquid flux (PDF)
Superior #4300-4% liquid flux (PDF)

SGS report for LF-4300 solder paste
Third Party Test Data (PDF 5mb)

LF-4300 testimonial: General Microcircuits
LF-4300 testimonial: BEC Electronics